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- BizLink Highlights Its Advanced Data Center Solutions at OCP Global Summit 2022
BizLink Highlights Its Advanced Data Center Solutions at OCP Global Summit 2022
As an interconnect industry leader, BizLink dedicates itself to researching and developing the latest product along with the data center evolution, at the same time, providing high-quality, customized product developing services. This year, BizLink showcased versatile interconnect solutions with the highlights of immersion cooling systems, rack and power solutions, 800G external cable interconnect, and PCIe6 solutions which have caught much attention at the OCP global summit 2022.
With the significant demands for high-speed cloud computing, future data centers have more strict requirements of computing efficiency and stability, data transfer speed, and thermal management, at the same time, strive for sustainability. BizLink’s immersion cooling systems are designed to achieve a more efficient thermal management system. Due to all the components submerged in non-conductive liquid, BizLink has developed products compatible with 3M immersion cooling fluid and set up high standards of material selection and reliability tests. BizLink commits itself to sustainability while providing high-quality and more efficient products for customers.
Alongside the improvement of data center infrastructure, the next step is to increase data transfer speed and safety. PCIe6 doubled the raw data rate to 64 GT/s, its high-speed and low-latency allow artificial intelligence, machine learning, and cloud computing to thrive. Meanwhile, PCIe6 is fully compatible with the previous five generations which makes PCIe6 a cost-effective and scalable solution. This year, apart from showcasing its latest PCIe6 products, BizLink has also developed 800G external cable interconnect solutions which adopt the low dielectric, low loss bulk cable to significantly reduce the cable outside diameters. It makes the data center cabling more flexible. BizLink's ORV3 external power solutions of cables and connectors, which include AC power and DC busbar power solutions for Powershelf, BBU, and IT Gear, and has been ready to provide customization design services. Meanwhile, with its global footprint, BizLink is able to offer professional integrated services from product design and development to manufacturing.
Regarding the results of the OCP global summit 2022, “We are happy to receive that much affirmation of our professional and high-quality services. BizLink has solid product design and development ability, and high standards for product quality, in addition, we have all the branches across the world,” said Mike Lin, Senior VP of the Computing and Transportation business group, “working with our customers closely, and turning their innovative concepts into reality have been and always will be our goals. In the future, we commit ourselves to continue to be a technology player and to provide more sustainable and more efficient interconnect solutions.”
BizLink, founded in 1996, is headquartered in Silicon Valley, USA. Our mission is to make interconnection easier and to become the leading global interconnect solution supplier. We support industries that are environmentally conscious and improve quality of life through providing essential components, wire harnesses, and cables to a wide variety of industries such as IT Infrastructure, Client Peripherals, Optical Fiber Communications, Telecom and Networking, Electrical Appliances, Healthcare, Factory Automation, Machinery and Sensors, Motor Vehicle, Rolling Stock, Marine, Industrial, and Solar. In addition, with flexible production resources and global R&D teams in America, Europe, and Asia, BizLink always provides reliable interconnect solutions in close proximity to markets. BizLink also specializes in providing one-stop EMS and NPI services based on customer's requests. At BizLink, we strive to keep collaborating closely with customers to turn their innovative ideas into reality. Visit www.bizlinktech.com.