OFC 2026

BizLink to Showcase High-Performance Optical Interconnect Solutions for AI Data Center at OFC 2026

Los Angeles, USA, March 9, 2026  — BizLink will participate in OFC 2026, a leading global event for optical communications, to present its latest optical interconnect solutions for AI data center infrastructure. As artificial intelligence and high-performance computing continue to drive higher data throughput and system density, BizLink and BizLink XFS Communications will feature connectivity solutions engineered to support next-generation AI network architectures and high-capacity deployments.

Co-Packaged Optics and Multi-Fiber Interconnect Solutions

BizLink and BizLink XFS Communications will present a CPO-ready optical interconnect architecture that increases fiber density for AI networking applications. Leveraging low-loss multi-fiber connectors including VSFF such as MMC, these interconnects support 20 or more single-mode fibers and operate within a temperature range of –20 °C to +70 °C. Supporting transmission requirements from 1.6T and beyond, this architecture enables efficient optical integration at the sub-system level for next-generation AI data center platforms.

BizLink leverages proprietary technologies that enable smart optical assembly, which streamlines the manufacturing process for high-volume production. This approach not only addresses the current high demand but also extends the benefits to Co-Packaged Optics within AI systems.

800G and 1.6T High-Speed Optical Interconnects and Transceivers

To address increasing data traffic across AI data center environments, BizLink will showcase 800G and 1.6T optical interconnects optimized for signal integrity within high-speed architectures. These interconnects support next-generation switch and server platforms and contribute to sub-system-level integration across high-density AI computing environments.

WDM Modules for High-Capacity Optical Networks

BizLink will demonstrate WDM modules that expand fiber capacity across AI data center and metro network environments. The offering includes CWDM and DWDM passive modules that support scalable optical transmission across high-density network architectures. These modules contribute to next-generation optical sub-system designs and enable efficient capacity expansion for large-scale network deployments.

Subsystem-Level Optical Integration for AI Infrastructure

“BizLink will showcase optical interconnect capabilities aligned with the evolving requirements of AI data center infrastructure,” said Eric Wu, Vice President of HPC Business Unit at BizLink. “By integrating optical connectivity with subsystem-level engineering expertise, we strengthen network architecture and enable scalable AI infrastructure deployment.”

BizLink integrates optical connectivity engineering with its global manufacturing footprint to advance AI infrastructure development. At OFC 2026, BizLink will highlight how its optical interconnect capabilities strengthen subsystem-level integration and enable high-density AI infrastructure across HPC environments.

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