Computex 2026

BizLink to Showcase Integrated Interconnect Solutions for the AI Ecosystem at COMPUTEX 2026

Taipei, Taiwan, June 2, 2026 – BizLink will participate in COMPUTEX 2026 to showcase integrated interconnect solutions for the AI ecosystem. At this leading event for AI, high-performance computing, and next-generation technologies, BizLink highlights solutions for high-power computing, high-speed copper and optical connectivity, intelligent mobility, and AI humanoid and robotics applications. Through its comprehensive portfolio, BizLink enables scalable AI deployments across next-generation applications and infrastructure environments.

HPC High-Power Solutions
BizLink will showcase high-power interconnect solutions for next-generation AI data centers, supporting up to 800V, 110kW shelf, and liquid-cooled 250kW rack-level architectures. As AI data centers scale across high-density computing environments, BizLink enables efficient and stable power distribution for large-scale AI deployment. 

HPC High-Speed Copper Interconnect Solutions
BizLink will present high-speed copper interconnect solutions for AI server and networking platforms, supporting 448Gbps per lane, PCIe Gen6/7, and Co-Packaged Copper (CPC) architectures. The showcase will also feature a live RMC demo with real-time monitoring for high-density AI systems. 

HPC High-Speed Optical Interconnect Solutions
BizLink will showcase Co-Packaged Optics (CPO) and transceiver interconnect solutions for next-generation AI network architectures. Integrating 1x64 optical switch, SN-MT/MMC multi-fiber connectivity, FAU, optical shuffle, and PIC technologies, the portfolio supports 1.6T and beyond for scalable AI networks. 

Mobility Solutions for EV, Drone and LEO Satellite Applications
BizLink will highlight intelligent mobility solutions for autonomous driving, electric vehicles, drone systems, and LEO satellite applications. Designed for next-generation mobility environments, BizLink delivers stable connectivity and efficient power integration across evolving mobility environments.

AI Humanoid and Robotics Connectivity Solutions
BizLink will showcase connectivity solutions for AI humanoid and robotics applications, addressing sensor-to-compute bottlenecks in real-time AI systems. Designed for low-latency and high-throughput performance, BizLink enables real-time data processing across robotics, industrial automation, and medical systems. 

Integrated Interconnect Solutions for the AI Ecosystem
“At COMPUTEX 2026, BizLink is proud to present integrated interconnect solutions designed for the evolving AI ecosystem,” said Mike Lin, Senior Vice President of the Computing and Transportation Business Group at BizLink.  “Through system-level integration across power, copper, and optical technologies, BizLink provides scalable AI infrastructure for next-generation computing, intelligent mobility, and AI-driven applications.” 

At COMPUTEX 2026, BizLink demonstrates how integrated interconnect technologies support the continued evolution of AI infrastructure across high-power computing, high-speed copper and optical connectivity, intelligent mobility, and AI humanoid and robotics applications. As AI deployment scales across next-generation environments, BizLink continues to advance scalable connectivity solutions for the evolving AI ecosystem. 

‍