AEE 2026

BizLink to Present Interconnect Solutions for Next-Gen Mobility at Automotive Engineering Exposition 2026 in Japan

Yokohama and Nagoya, Japan, May 2026 — BizLink will participate in Automotive Engineering Exposition 2026 to present interconnect solutions supporting autonomous driving, smart cockpit, and vehicle electrification applications. As one of Japan’s leading exhibitions for automotive engineering and development professionals, the event brings together industry experts focused on next-generation vehicle technologies. BizLink highlights scalable interconnect solutions supporting high-speed data transmission, power delivery, and integration across evolving vehicle architectures.

Autonomous Driving

BizLink integrates 48V power and 100 Mbps Ethernet through interconnect solutions to help reduce actuator power loss and improve energy efficiency in autonomous driving applications. High-speed automotive Ethernet further supports data rates up to 10 Gbps, enabling zonal E/E architectures with advanced AI computing capabilities. 

Smart Cockpit

BizLink showcases in-vehicle interconnect solutions including waterproof USB Type-C connectors compliant with USCAR 30 and Mini-FAKRA with ASA Motion Link (ASA-ML) SerDes technology. These solutions support high-speed data transmission for camera and sensor systems, helping simplify system architecture and supporting smart cockpit integration.

Electrification

BizLink provides compact on-board power distribution solutions featuring silicone cables and busbars supporting operation up to 200°C. The portfolio includes NACS solutions ranging from 16/32 A portable EVSE to 500 A liquid-cooled charging connectors, along with MCS solutions rated up to 1500 A for heavy-duty and commercial vehicles.

Interconnect Solutions for Next-Gen Mobility
“BizLink provides interconnect solutions designed to support autonomous driving, smart cockpit, and vehicle electrification applications,” said Younger Wang, Senior Vice President of Vehicle Solution Business Unit at BizLink. “By integrating power, signal, and high-speed data capabilities, we help customers improve development efficiency across next-generation vehicle architectures.”

At Automotive Engineering Exposition 2026, BizLink highlights how its mobility interconnect portfolio supports performance, integration, and deployment needs across next-generation mobility applications.