December 24, 2021
<< Back

Tokyo Automotive World 2022


Welcome to Visit BizLink at Tokyo Automotive World 2022

DesignCon is the premier high-speed communications and system design event, offering industry-critical engineering solutions in the heart of electronics innovation—Silicon Valley. As a global leader in interconnect solutions, BizLink is committed to enabling reliable high-speed communications in the digital world. This year we are excited to showcase our advanced interconnect solutions in two themed booths. We’d like to invite you to come and discover BizLink’s total solutions for servers, data centers, and edge computing.
┃Booth 1154
Data Center Interconnects (800G ACCs and DACs, as well as 400G AOCs), 800G Loopback Test Adapters, and Advanced High-Speed Cables

BizLink, a leading global interconnect solutions provider, is your trustworthy partner in customization and manufacturing. We make data center connectivity more flexible, stable, and efficient. Our global R&D and service teams in America, Europe, and Asia are always ready to collaborate closely with you to turn your innovative designs into reality.

Date January 19 - 21, 2022
Location Tokyo Big Sight, Japan
Booth No. 36-41, East Hall 5