December 18, 2018
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DesignCon 2019


            Welcome to visit BizLink's booth 1239 at DesignCon 2019.
DesignCon is a mega event that brings together professionals from the high-speed communications. We cordially invite you to visit us at our booth 1239 from Jan. 30 to 31 to discover BizLink's latest interconnect solutions, such as direct attach cables (DAC), active optical cables (AOC), active copper cables (ACC), transceiver modules, loopback modules, and USB Type-C active cables.
BizLink is an experienced and trustworthy partner in customization and manufacturing. We provide you with high-quality OEM and ODM services. Our global R&D and service teams in America, Europe, and Asia are always ready to collaborate closely with you to turn your innovative designs into reality.

Date January 30 - 31, 2019
Location Santa Clara Convention Center, Santa Clara, CA
Booth No. 1239
Contact Sales Representative