Xponential US 2026

BizLink to Showcase Low-SWaP Interconnect Solutions for AI Unmanned Vehicles at Xponential US 2026 in Detroit

Detroit, MI, United States, Apr 21, 2026 — BizLink will participate in Xponential US 2026, a global platform advancing unmanned vehicles across air, land, sea, and space, to showcase low-SWaP (Size, Weight, and Power) interconnect solutions.

AI perception enables unmanned vehicles (UVs) to operate autonomously, acting as the "eyes and brains" that allow machines to observe, interpret, and act upon their surroundings without human intervention. However, designing them with Low-SWaP characteristics are crucial for maximizing operational endurance, enabling edge computing, and allowing compact deployment. BizLink addresses these demands through system-level solutions including connectors, cables, SerDes modules and AI computing platforms.

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Integrated power and data connectors for reducing size

As moving from 12V to 48V power backbone improves power efficiency by 30-50% for unmanned vehicles, BizLink offers panel mount and in-line 48V hybrid connectors that integrate power and signal pins within a single interface to reduce the routing footprint. The connectors feature the maximum current rating of 32A, sealed designs (IP67) for harsh environments, and vibration-resistant locking mechanisms.

Thin multi-camera coaxial interconnects for low weight

By reducing the diameter of the conventional coaxial cables for FAKRA/Mini-FAKRA connectors, the thin coaxial cable with 1.8mm diameter is suitable for delivering data and power on unmanned vehicles requiring low weight. Terminals of the FAKRA/Mini-FAKRA connectors are also modified to keep the impedance variation low to reduce return losses.

Centralized real-time AI perception for lower power consumption‍

Multiple sensors including cameras and lidars are integrated with a centralized perception architecture to enable multi-sensor fusion without compression trade-offs. This software-defined networked perception system improves power efficiency at the system level. In addition, it simplifies sensor integration complexity and allows for the addition of new sensors in the future.

Besides the low SWaP interconnects, BizLink also showcases aerospace-grade optical fiber modules and high-speed/power cable assemblies developed for extreme environments, e.g. severe temperature swings, vacuum conditions, and EMI.

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“As AI perception increases sensing, computing, and communication requirements, unmanned vehicles need low SWaP interconnect solutions for maximizing operational endurance,” said Younger Wang, Senior Vice President of the Vehicle Solution Business Unit at BizLink.

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BizLink showcases power, signal, and optical interconnect designs, which enable efficient system integration and support scalable platform developments across autonomous applications.

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