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Head of Precision Connector Manufacturing Center
BizLink is seeking a visionary engineering leader to spearhead our Precision Connector Manufacturing Center in Tainan. You will build and manage a world-class production team focused on next-generation, high-precision interconnect solutions (e.g., backplane, overpass, and PCIe Gen7 connectors). By bridging advanced R&D with scalable manufacturing, you will drive operational excellence to meet the rigorous demands of global Tier-1 customers in the rapidly growing AI Server and HPC markets.
Key Responsibilities:
- Team Building & Leadership: Establish and scale a comprehensive engineering and production team, encompassing precision mold injection, stamping, automation engineering, and a tooling manufacturing center.
- Operational Excellence: Oversee operational planning and facility management to ensure seamless alignment with global customer demands.
- Cross-Functional Collaboration: Partner closely with R&D and tooling design teams to execute Design for Manufacturing (DFM) reviews and accurate cost estimations.
- Advanced Manufacturing: Direct the manufacturing of ultra-high-precision mold components for cutting-edge high-speed products.
- Global Customer Management: Manage engineering and production affairs for global Tier-1 clients, ensuring exceptional performance in product delivery, inventory control, quality assurance, and cost reduction.
- Ad-hoc Assignments: Execute other strategic tasks and projects as directed by executive management.
Job Requirements
- Bachelor’s degree or above in Electrical Engineering, Electronic Engineering, Mechanical Engineering, Materials Science, Physics, Electro-Optical Engineering, or a related field.
- Minimum of 10 years of overall working experience, with 5 to 10+ years specifically in the design and development of high-speed connectors or cable modules.
- Deep understanding of high-speed signal transmission principles (SI) and EMC/EMI, including differential signaling, impedance matching, crosstalk, skew, return loss, and insertion loss.
- Familiar with cutting-edge industry standards such as PCIe Gen5/Gen6, USB4, SAS4, QSFP-DD, OSFP, CXL, and Ethernet 400G/800G.
- Expertise in mechanical architecture, including Housing, Terminal, Shell, and EMI structure design.
- Proficiency in Ansys HFSS, SIwave, CST, and Keysight ADS.
- Hands-on experience with VNA, TDR, Eye Diagram analysis, and BER Testing.
- Demonstrated ability to integrate and lead cross-functional teams (R&D, Manufacturing, Testing, QA, Sales) through the NPI process and DFx methodologies (DFM, DFT, DFA).
- Strong capabilities in Project Management and schedule control.
- Fluent in English (Listening, Speaking, Reading, and Writing).
- Proven track record of interfacing directly with global clients' technical teams to align on specifications and troubleshoot issues.
- Ability to propose strategic new product directions based on industry trends (e.g., AI Servers, CPO, 800G/1.6T electro-optical integration).
Preferred Qualifications (Plus)
- Technology Integration: Experience with Co-Packaged Optics (CPO) or Silicon Photonics modules (SiPh, FAU, MPO integration).
- Software Proficiency: Familiarity with 3D CAD software (SolidWorks, Creo) and PCB Layout tools (Altium, Cadence).
- Hands-on Measurement: Practical operation experience with testing equipment from Keysight, Anritsu, or Tektronix.
- Industry Pedigree: Previous tenure at leading high-speed connector manufacturers (e.g., TE, Amphenol, Molex, Samtec, Luxshare, Foxconn).
- Strategic Vision: Ability to define a product roadmap targeting AI/HPC, high-speed automotive, CPO, and optical markets.
- Leadership Traits: Exceptional mentoring skills to lead agile squads in module development and validation.
BizLink is looking for the best & brightest talent
No matter the location, or the role, every BizLink employee shares one mission: Make interconnection easier to improve the quality of life and turn customers' innovative ideas into reality.
Have questions about our positions? Feel free to email us at: recruitment@bizlinktech.com
Please note: This email is for inquiries only. To be considered, all applications must be submitted by clicking the "Apply Now" button on the job posting.
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