BizLink Partners with ams OSRAM to Advance Photonics for AI Data Center Interconnects

BizLink Partners with ams OSRAM to Advance Photonics for AI Data Center Interconnects

FREMONT, Calif., September 21, 2026—BizLink today announced an ecosystem partnership with innovative light and sensor solutions leader ams OSRAM to co-develop next-generation optical interconnect solutions for AI scale-up domains. Leveraging its core strengths in fiber array assembly, optical packaging, optical testing, and high-volume manufacturing, BizLink is collaborating with ams OSRAM to demonstrate a revolutionary low-power, low-latency "wide-and-slow" optical link technology at the upcoming ECOC 2026 conference and exhibition.

The rise of artificial intelligence and the required training infrastructure is redefining the requirements for intra-datacenter connectivity. Bigger AI scale-up domains require interconnects designed for power, latency, density, and reliability together. To address this bottleneck, this innovative optical architecture directly targets these critical requirements. Rather than pushing ever more data through a few complex, power-hungry high-speed channels, this approach distributes data across numerous parallel, lower-speed channels, achieving extended reach and ultra-low latency while preserving cost and power efficiency.

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ECOC 2026 Live Demonstration 

At the upcoming ECOC 2026 conference and exhibition in Spain (September 21–23), BizLink and ams OSRAM will present a connectorized multi-core fiber solution. Shown in a private room, the optical link demonstrator features a 2D addressable microVCSEL array with an 850 nm wavelength paired with BizLink's specialized fiber-to-fiber connector and optical packaging.

“This demonstrator validates a fundamentally different optical interconnect for low power and low latency wide-and-slow interconnects. By combining ams OSRAM's addressable microVCSEL technology with BizLink's expertise in fiber-array integration, optical packaging, and manufacturing we have pushed the boundaries in optical interconnect technology,” said Hendrik Coldenstrodt, CTO of the Computing and Transportation Business Group at BizLink.

“We’re very excited to partner with BizLink to co-develop and demonstrate a high-performance optical data link based on our wide-and-slow interconnect architecture and our photonics engine. Together we’re creating a powerful ecosystem with the goal to industrialize this new architecture at scale.” said Ashkan Seyedi, Vice President and General Manager of the Optical Interconnects Business Line at ams OSRAM. 

Long committed to HPC and data centers, BizLink continues to advance its leadership in high-speed and optical interconnects. This collaboration with ams OSRAM highlights BizLink’s expertise in AI optical packaging and optoelectronic manufacturing. Moving forward, BizLink remains dedicated to collaborating with global partners to empower the CPO industry for next-generation AI.

About BizLink 

Founded in 1996 and headquartered in Silicon Valley, USA, BizLink is dedicated to making transformative connections that bring visionary ideas to life. We specialize in providing essential components such as wire harnesses, connectors, and cables to a broad spectrum of industries. Our global presence, with flexible production resources and R&D teams across America, Europe, and Asia, allows us to proactively drive innovation and enable future possibilities. At BizLink, our customer-centric approach and commitment to relentless advancement empower us to deliver zero-distance service and continual performance optimization, making a positive and meaningful impact worldwide. We turn possibilities into reality; furthermore, we connect possibilities to world-changing visions.

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About ams OSRAM

The ams OSRAM Group (SIX: AMS) is a global leader in innovative light and sensor solutions. As a specialist in Digital Photonics, we combine engineering excellence with cutting-edge global manufacturing to offer our customers the broadest portfolio of digital light and sensing technologies.

“Sense the power of light” — our success has ever since been based on a deep understanding of the potential of light. For 120 years, we have been developing innovations that move markets: from automotive applications and industrial manufacturing to medical and consumer electronics. In the anniversary year of the OSRAM brand, around 19,000 employees worldwide are working on pioneering solutions alongside societal megatrends such as smart mobility, artificial intelligence, augmented reality, smart health, and robotics. This is reflected in over 12,000 patents granted and applied for. Headquartered in Premstaetten/Graz (Austria) with co-headquarters in Munich (Germany), the group achieved EUR 3.3 billion revenues in 2025 and is listed as ams-OSRAM AG on the SIX Swiss Exchange (ISIN: AT0000A3EPA4). 

Find out more about us on https://ams-osram.com  

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ams OSRAM at ECOC 2026

At ECOC 2026, ams OSRAM is unveiling its latest breakthrough in Thin-Film VCSEL technology and demonstrates a connectorized multi-core fiber solution in collaboration with BizLink, maturing the ecosystem for highly parallel, ultra-low-power optical interconnects for AI Scale-up. While access to the demonstration area is limited, all ECOC visitors are invited to stop by booth 1281 to engage with our experts, exchange ideas and explore how ams OSRAM is helping drive the future of AI connectivity.

Find out more about ams OSRAM’s AI photonics technology via our dedicated technology page.