BizLink to Showcase Advanced Interconnect Solutions for EV and AI Technologies at Automotive Engineering Exposition 2025 NAGOYA

Nagoya, Japan – July 14, 2025 – BizLink, a global leader in interconnect solutions, will present its latest innovations for electric vehicles (EVs) and AI high-performance computing (HPC) at Automotive Engineering Exposition 2025 NAGOYA, taking place from July 16 to 18 at Aichi Sky Expo. At Booth 181, visitors will discover how BizLink’s technologies are helping shape the future of intelligent mobility and data infrastructure.

As the automotive and tech industries continue to evolve rapidly, BizLink remains at the forefront—delivering scalable, high-performance interconnect solutions that drive electrification, autonomous systems, and next-generation mobility. This year’s showcase highlights BizLink’s expanded capabilities across two transformative sectors: smart mobility and AI HPC infrastructure.

In the EV segment, BizLink will unveil its latest smart power electrification systems, including high-tolerance busbar platforms, compact Power Distribution Units (PDUs), and shielded high-voltage cable assemblies—all engineered to ensure reliable energy transfer in demanding environments. Also featured are smart charging interfaces that support both NACS and CCS2 standards, including modularized inlets, UL-certified connectors, and portable chargers that enhance vehicle integration with a focus on safety, efficiency, and space optimization.

For intelligent vehicles, BizLink will present solutions that enhance in-cabin connectivity and data transfer. These include USB Type-C power delivery systems, automotive-grade charging ports, and compact signal-power combo modules—all tailored to support evolving smart cockpit designs. For AI-assisted autonomous driving systems, BizLink will demonstrate high-speed data interconnects such as Mini-FAKRA and Single-Pair Ethernet (SPE) connectors, designed to enable fast, secure communication between ADAS units, sensors, and control modules.

Beyond mobility, BizLink will also highlight its advanced interconnect solutions for AI data centers and HPC environments. This includes high-speed signal and power cable assemblies, PCIe and QSFP interconnects, and customizable infrastructure systems optimized for thermal management and scalability across GPU clusters and AI server applications.

With vertical integration, a strong global R&D network, and a deeply customer-centric approach, BizLink empowers partners to accelerate innovation and bring forward-looking solutions to market with speed, precision, and confidence.

“Today’s EV and AI markets demand a new level of integration, reliability, and performance,” said Younger Wang, Senior Vice President of the Vehicle Solution Business Unit at BizLink. “At this year’s exhibition, we’re proud to showcase how our interconnect technologies are enabling the next generation of smart transportation and computing.”