BizLink Showcased Scalable AI and HPC Infrastructure Solutions at OCP APAC 2025

Taipei, Taiwan – August 8, 2025 – BizLink, a global leader in interconnect solutions, presented its latest high-performance infrastructure technologies at OCP APAC 2025, and showcased its system-level solutions for AI computing and high-performance computing (HPC), with a focus on scalability, integration, and deployment efficiency across next-generation data centers. 

This year’s showcase centered on BizLink’s rack system, a modular platform designed to support advanced interconnect and power architectures. The company demonstrated how its vertically integrated capabilities, including cable assemblies, power delivery, and fiber connectivity, enable data center operators to accelerate infrastructure development while optimizing power efficiency, signal performance, and space utilization. As AI and HPC workloads continue to scale globally and drive infrastructure evolution, BizLink remains committed to delivering scalable, high-performance solutions that address the growing complexity of modern data centers. At OCP APAC 2025, BizLink highlighted four key areas of innovation: 

1.6T High-Speed Connectivity Solutions: BizLink’s high-speed interconnect solutions delivered 1.6T transmission with robust signal integrity and thermal performance, supporting scalable data processing in AI and HPC environments. 

PCIe Gen6 High-Speed Solutions: BizLink’s PCIe Gen6 solutions were designed to support data rates up to 64Gbps per lane while maintaining system stability and signal performance across compute-intensive deployments. 

OCP ORV3 Power Solutions: BizLink’s AC and DC power and busbar systems supported up to 140kW per rack and 33kW per power shelf. These solutions were engineered to enable reliable energy distribution and power scalability for high-density rack environments. 

Multi-Fiber Optical Interconnect Solutions: BizLink demonstrated Co-Packaged Optics (CPO) and silicon photonics connectivity through multi-fiber deployments that optimize space usage, simplify installation, and enable flexible, high-efficiency networks for next-generation data centers. 

BizLink continues to drive innovation in system-level infrastructure to help customers meet the evolving demands of AI-driven data centers. From 1.6T high-speed connectivity and PCIe Gen6 signal performance to scalable power delivery and CPO optical networks, BizLink provides a comprehensive range of interconnect and power solutions built for rapid deployment and long-term efficiency.

Mike Lin, Sr. Vice President at BizLink, stated: “At OCP APAC 2025, we were proud to present solutions that help data center customers enhance integration and scale with confidence. Looking ahead, we remain focused on enabling next-generation infrastructure through performance, precision, and scalability.”