2026 ODX

BizLink to Showcase High-Speed Interconnect Solutions for AI Infrastructure at 2026 ODX

Beijing, China, August 31, 2026 – BizLink will participate in 2026 ODX in Beijing to present its connectivity and leak detection solutions for AI infrastructure. Bringing together the computing ecosystem, 2026 ODX focuses on advances across computing, networking, storage, liquid cooling, and data center technologies. The featured portfolio includes 1.6T connectivity, PCIe Gen6 high-speed interconnect, and liquid cooling leak detection solutions for AI servers, networking platforms, and liquid-cooled data center environments.

1.6T Connectivity Solutions

The 1.6T connectivity portfolio features connectors, cages, cables, and loopback products supporting up to 224 Gbps per lane and 1.6T total bandwidth. For AI servers, networking switches, and high-density rack interconnects, the solutions maximize throughput while ensuring reliable signal integrity.

AI Infrastructure High-Speed Interconnect Solutions

PCIe Gen6 high-speed interconnect solutions support AI server and networking platforms for high-bandwidth applications. The portfolio provides greater installation flexibility, cost-efficient system integration, and enhanced connector protection while maintaining reliable connectivity across evolving AI architectures.

Liquid Cooling Leak Detection Solutions

Leak detection cable and FPC solutions support liquid-cooled servers, networking switches, racks, manifolds, and cooling distribution units. Real-time monitoring and signal transmission to system BMC/RMC enable automated responses, helping reduce leakage risks while minimizing equipment damage and operational loss.

High-Speed Connectivity for Evolving AI Infrastructure

“As AI infrastructure advances toward higher bandwidth and greater computing density, reliable connectivity and effective monitoring are becoming increasingly important,” said Eric Wu, Vice President and Head of the HPC Business Unit at BizLink. “By combining external and internal interconnect solutions with leak detection capabilities, BizLink helps customers address evolving requirements across AI server and data center applications.”

At 2026 ODX, BizLink will highlight the value of integrating high-speed external and internal interconnects with liquid cooling leak detection for reliable data transmission and monitoring. This integrated approach supports the continued development of next-generation AI infrastructure.

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