BizLink Showcasing Complete AI and HPC Rack Solutions at OCP Global Summit 2025

BizLink Showcasing Complete AI and HPC Rack Solutions at OCP Global Summit 2025

San Jose, USA – October 13, 2025 – BizLink will showcase its latest AI and HPC rack systems at the OCP Global Summit 2025, the leading event for open collaboration and scalable data center innovation. With expertise in interconnect, power, and optical integration, BizLink will present advanced solutions designed to optimize system performance, reliability, and scalability for next-generation AI and HPC infrastructure.

224 Gbps/lane Co-Packaged Copper (CPC) and 1.6T High-Speed Interconnect Solutions
BizLink delivers cutting-edge 224Gbps/lane co-packaged copper cables (CPC) designed to reduce insertion loss, extend copper transmission distance, and lower power consumption. This high-performance solution supports scalable deployments and future high-speed expansions for AI and HPC infrastructure.

In addition to the CPC, BizLink’s portfolio includes 1.6T high-speed interconnects with strong signal integrity, low latency, and energy efficiency. The lineup also features liquid cooling leakage sensor cables for real-time safety monitoring, ensuring reliable operation in demanding environments. Optical interconnects further enhance bandwidth density and space efficiency, contributing to overall performance and future-ready data center design.

PCIe Gen6 Internal Interconnect Solutions
The portfolio includes DC-MHS MXIO Gen5/Gen6 cables for low-loss transmission, NVIDIA MGX™ DA-CEM PCIe Gen6 risers for flexible GPU deployment, wafer frame MCIO Gen6 cables with a path toward Gen7, and compact MCIO/M-Trak board connectors for reliable signal integrity. This portfolio enables stable integration and scalable deployments for next-generation AI and HPC platforms.

OCP-Compliant Power Solutions
BizLink introduces AC100A+ and DC400V/800V architectures for compute and power racks, including the industry’s first safety-compliant liquid cooling busbar. These designs provide efficient and reliable power delivery, supporting large-scale deployments of AI and HPC systems from 72kW to 110kW.

Co-Packaged Optics & Multi-Fiber Interconnect Solutions
Supporting 8 to 32 single-mode fibers with VSFF interfaces, BizLink’s optical solutions enable low-loss, high-density connectivity from 10G to 1.6T and beyond. CPO-ready designs ensure scalable, space-efficient networks that address the growing demands of AI and HPC data centers.

“BizLink delivers system-level solutions that enhance scalability and efficiency for AI and HPC infrastructure,” said Mike Lin, Senior Vice President of the Computing and Transportation Business Group at BizLink. “By integrating co-packaged copper (CPC), high-speed interconnects, OCP-compliant power, and CPO-ready optics, BizLink supports data center operators in accelerating next-generation deployments with confidence.”

BizLink continues to strengthen its role in advancing data center infrastructure by delivering system-level solutions that integrate interconnect, power, and optical domains. At OCP Global Summit 2025, BizLink demonstrates how its comprehensive portfolio empowers data center operators to achieve performance, efficiency, and scalability in next-generation AI and HPC infrastructure.

‍

About BizLink
Founded in 1996 and headquartered in Silicon Valley, USA, BizLink is dedicated to making transformative connections that bring visionary ideas to life. We specialize in providing essential components such as wire harnesses, connectors, and cables to a broad spectrum of industries including HPC, AI, semiconductor technology, IT infrastructure, optical fiber communications, telecom and networking, automotive, electrical appliances, medical & healthcare, factory automation, industrial robotics, rolling stock, and marine. Our global presence, with flexible production resources and R&D teams across America, Europe, and Asia, allows us to proactively drive innovation and enable future possibilities. At BizLink, our customer-centric approach and commitment to relentless advancement, along with a strong focus on sustainability and compliance in both our products and processes, empower us to deliver zero-distance service and continual performance optimization, making a positive and meaningful impact worldwide. We turn possibilities into reality; furthermore, we connect possibilities to world-changing visions.

‍