BizLink Showcases Power, Connectivity and Liquid Cooling Solutions for AI Data Centers at OCP Global Summit 2026

BizLink Showcases Power, Connectivity and Liquid Cooling Solutions for AI Data Centers at OCP Global Summit 2026

San Jose, California, 07 October 2026 –  BizLink will participate in OCP Global Summit 2026, showcasing integrated interconnect solutions designed to support the evolving requirements of AI infrastructure. As part of the BizLink Group, Interplex is a global leader in designing and manufacturing high-precision interconnect solutions and custom mechanical products, with advanced engineering expertise serving the data center market. The featured portfolio covers power, high-speed copper, rack monitoring and liquid cooling, as well as optical interconnects for scalable AI deployments.

AI Infrastructure Power Solutions

BizLink will present high-power interconnect solutions supporting OCP and NVIDIA MGX™ rack solutions, including 800V/400Vdc power solutions, liquid-cooled integrated solutions, and special next-generation power designs for power racks and compute racks. The portfolio enables efficient and stable power distribution in high-density AI data center environments for large-scale AI infrastructure deployments.

AI Infrastructure High-Speed Copper Solutions

BizLink will feature PCIe Gen6 DA-CEM, EDSFF Hybrid, and MCIO-AC cable assemblies supporting AI server and networking platforms. The portfolio also includes 448G bulk cable and 1.6T connectivity solutions, supporting high-bandwidth applications across evolving AI architectures.

AI Infrastructure Rack Monitoring and Liquid Cooling Solutions

For liquid cooling environments, BizLink will showcase liquid-cooled OSFP cages designed for next-generation 1.6T OSFP network switches, alongside Rack Management Controllers (RMCs). With daisy-chain leak detection featuring node identification and modular architecture, the portfolio simplifies maintenance, enhances system safety, and improves scalability in AI data centers.

AI Infrastructure Optical Interconnect Solutions

BizLink will present Co-Packaged Optics (CPO), 800G/1.6T and XPO optical transceiver interconnect solutions for next-generation AI networking needs. Integrating FAU, SN-MT/MMC multi-fiber connectivity, optical shuffle and fanout fiber connectivity, the portfolio enables 1.6T and beyond connectivity for scalable AI networks.

Integrated Interconnect Solutions for Scalable AI Infrastructure

“The continued growth of AI infrastructure is driving greater demand for reliable connectivity across high-density data center environments,” said Eric Wu, Vice President and Head of the HPC Business Unit at BizLink. “Interplex brings high-precision interconnect and custom mechanical expertise to support complex data center design and manufacturing requirements. With system integration expertise and a comprehensive interconnect portfolio, BizLink helps customers accelerate AI infrastructure deployment.”

At OCP Global Summit 2026, BizLink will showcase integrated solutions across power, high-speed copper, optical interconnects, as well as rack monitoring and liquid cooling. BizLink continues to advance reliable connectivity solutions that support scalable AI infrastructure.