BizLink Partners with SENKO and ficonTEC to Pioneer Optical Interconnect Breakthrough at SEMICON Taiwan 2025

Taipei, Taiwan – September 8, 2025 – BizLink Group, together with SENKO Advanced Components and ficonTEC Service GmbH, is collaborating to develop an integrated optical interconnect solution to be showcased at SEMICON Taiwan 2025. This innovative collaboration directly addresses the rapidly growing high-volume manufacturing needs of Co-packaged Optics (CPO) and Silicon Photonics (SiPh), crucial technologies for advancing optical communication and AI data centers.

The collaboration combines:

• SENKO’s expertise in high-performance optical connectivity.
• BizLink’s leadership in precision interconnect manufacturing.
• ficonTEC’s automation capabilities in photonics assembly and test.

Together, the companies are advancing fully automated optical interconnection and fiber preparation processes designed for high-volume manufacturing. These solutions are built to deliver higher data speeds, greater density, and scalable production to meet the surging demands of AI, cloud infrastructure, and HPC systems.

This partnership provides a complete ecosystem that ensures:

• Enablement of high-volume manufacturing and testing.
• Reduced deployment risks.
• Consistent product quality.

Visitors to SEMICON Taiwan 2025 can meet with experts from all three companies to learn how this integrated approach enhances performance, accelerates deployment, and simplifies scaling for next-generation applications.

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About BizLink

BizLink is a leading innovator in optical communication technologies, specializing in advanced fiber solutions, co-packaged optics, and automated manufacturing processes. Our commitment to driving industry progress is reflected in strategic partnerships and technical breakthroughs that support next-generation data infrastructure.

About SENKO

SENKO is a global leader in the development of photonic components and solutions. With a rich history of innovation and a commitment to excellence, SENKO provides a wide range of products that enable the advancement of silicon photonics, telecommunications, data communications, and other high-tech industries.

About ficonTEC

ficonTEC is dedicated to delivering high-precision assembly and test solutions for silicon photonics devices, including fiber and waveguide alignment, photonics-related assembly, automated testing, and heterogeneous integration technologies essential for scalable production. In addition, our experts will be available for in-person discussions to share the latest application cases and industry insights, helping you explore how our system approach can accelerate the transition from R&D to volume manufacturing.