OCP APAC Summit 2026

BizLink to Showcase Scalable AI Infrastructure Solution at OCP APAC Summit 2026

Taipei, Taiwan, Jul 15, 2026 – BizLink will participate in OCP APAC Summit 2026 to present its integrated interconnect solutions for scalable AI infrastructure. At the event, BizLink will feature solutions across power, high-speed copper, rack monitoring, and optical interconnects that support the growing needs of next generation AI data centers.

AI Infrastructure Power Solutions
BizLink will highlight high-power interconnect solutions supporting OCP and MGX rack solutions. Designed for high-density AI data center environments, the portfolio enables efficient and stable power distribution for large-scale AI infrastructure deployments. 

AI Infrastructure High-Speed Copper Solutions
BizLink will present PCIe Gen6 high-speed copper interconnect solutions for AI server and networking platforms. Built for high-bandwidth applications, the portfolio enables flexible installation, cost-efficient system integration, and enhanced connector protection across evolving AI architectures. 

AI Infrastructure Rack Monitoring Solutions
BizLink will introduce daisy-chain leak detection solutions designed for intelligent rack monitoring. Featuring node-based identification and modular architecture, the solutions enable precise leak detection, simplified maintenance, and scalable monitoring across high-density AI data center environments. 

AI Infrastructure Optical Interconnect Solutions
BizLink will feature Co-Packaged Optics (CPO) and transceiver interconnect solutions for next-generation AI network architectures. Integrating FAU, SN-MT/MMC multi-fiber connectivity, optical shuffle, and fanout fiber connectivity, the portfolio supports 1.6T and beyond for scalable AI networks. 

Integrated Interconnect Solutions for Scalable AI Infrastructure
“As AI infrastructure continues to scale, reliable power distribution, high-speed connectivity, and intelligent rack monitoring are becoming increasingly important,” said Eric Wu, Vice President and Head of the HPC Business Unit at BizLink. “By integrating capabilities across power, high-speed copper, rack monitoring, and optical interconnects, BizLink delivers comprehensive interconnect solutions to address the evolving requirements of next-generation AI data centers.”

At OCP APAC Summit 2026, BizLink will highlight its capabilities across power, high-speed copper, rack monitoring, and optical connectivity. By bringing these solutions together at the system-level integration, BizLink continues to deliver reliable connectivity solutions for next-generation AI infrastructure.