GTC 2026

BizLink to Unveil Advanced Solutions for NVIDIA Vera Rubin and 800 VDC Power-Dense AI Data Centers at NVIDIA GTC 2026

FREMONT, Calif. – March 16, 2026 – BizLink, a leading global provider of high-performance interconnect solutions, today announced its participation at NVIDIA GTC 2026, the premier global event of the AI era. At the exhibition, BizLink will present its latest technological innovations, highlighting its ongoing collaboration with NVIDIA to enable the next generation of accelerated computing.

As the demands of AI infrastructure rapidly evolve, the need for power-dense, high-speed interconnect solutions has never been more critical. At this year's event, BizLink will demonstrate its specialized role in developing essential power architecture components, highlighting its support for the NVIDIA Vera Rubin platform and the industry's shift toward 800 VDC power distribution in next-generation AI data centers.

Next-Generation AI Data Center Solutions

• Power Whip: Specifically engineered for the NVIDIA Vera Rubin platform, this AC power whip is designed to support seamless power interconnection from the grid directly to the AI rack.
• Liquid-Cooled Rack Busbar: Designed to support rapid, year-over-year growth in rack-level power for improved performance per watt, this direct liquid-cooled rack busbar offers superior heat dissipation compared to traditional forced-air alternatives. It integrates with existing liquid cooling racks, enhancing total heat exchange capabilities at the busbar clip or shelf level while maximizing power usage effectiveness (PUE) in data center applications for the NVIDIA MGX architecture.
• Shelf Busbar: Engineered to support high power densities within the limited space of power shelves, this busbar provides high-current interconnection with robust insulation, fully compatible with NVIDIA MGX architecture.
• Internal Power Components: Inner busbars and busbar cable connectors built specifically to support the NVIDIA Vera Rubin platform.
• High-Performance Server Cables: A wide range of server cables explicitly designed for the MGX Ecosystem and engineered for maximum reliability under heavy data loads.

Advanced Automotive and Network Interconnects

• In-Vehicle Interconnects: Seamless in-vehicle interconnects featuring waterproof USB Type-C (USCAR 30 compliant) and Mini-FAKRA solutions equipped with the upcoming ASA Motion Link (ASA-ML) SerDes interface. These products enable high-speed data transmission, simplifying and accelerating integration.
• CPO-Ready Optical Interconnects: Utilizing low-loss multi-fiber connectors, including VSFF, these interconnects support 20 or more single-mode fibers. With an operating temperature range of –20°C to +70°C, these solutions support network deployments of 1.6T and beyond, enabling highly scalable network architectures across AI and High-Performance Computing (HPC) environments.

We are incredibly proud to collaborate with NVIDIA to push the boundaries of AI infrastructure,” said Eric Wu, Vice President of the High Performance Computing Business Unit at BizLink. “Our new power and cooling interconnects are specifically engineered to meet the power density and thermal challenges of tomorrow's data centers.'" 

At NVIDIA GTC,  BizLink showcases firsthand a comprehensive suite of advanced power, cooling, and data transmission solutions.

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