2020-09-15
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BizLink announces its BzKlip Connector with rated currents up to 300A

Designed for power distribution of data center servers, hyperscale computing architecture, modular power supplies, etc.

Key Features of BzKlip Connector Series:
  • Featured with low contact resistance, gold plating, and high conductivity to secure high reliability and system efficiency in high current applications
  • Support single-pole DC applications with rated currents up to 300A
  • Mated with specified copper blades for easy assembly and maintenance
  • Designed with screw-mounted fixation and high temperature thermoplastic housing

September 15th, Taipei, Taiwan – BizLink, a global leader in interconnect solutions, is proud to announce the availability of its BzKlip connector series. The highly reliable BzKlip connector series features rated currents of up to 300A. It is especially designed for power distribution of data center servers, hyperscale computing architectures, modular power supplies, rack-mounted high power systems, and industrial applications.

BizLink’s BzKlip connector series offers low power consumption and high conductivity for improving system efficiency. It can be mated with copper busbar blades for easy installation on busbars. With simplicity in design, the connector can be easily assembled and disassembled. The BzKlip connector series is UL1977 and IEC61984 certified to ensure the safety of power distribution. The connector also meets the group testing standards according to EIA-364 to secure its reliability and design quality. In addition, the connector is designed with screw-mounted fixation and high temperature thermoplastic housing. BizLink keeps developing its new BzKlip connector with rated currents up to 400A for the power distribution component market. It is specifically dedicated for the applications of high-grade power shelves.  Contact Us


                                                     
Highly Reliable BzKlip Connector Series                 Designed with Screw-mounted Fixation and Thermoplastic Housing


About BizLink
BizLink, founded in 1996, is headquartered in Silicon Valley, USA. Our mission is to make interconnection easier and to become the leading global interconnect solution supplier. We support industries that are environmentally conscious and improve quality of life through providing essential components, wire harnesses, and cables to a wide variety of industries such as IT and CE, Motor Vehicle, Electrical Appliances, Medical Equipment, Industrial, Optical Fiber Communications, and Solar. Our vertically integrated business model includes manufacturing sites in the United States, Mexico, Slovakia, Serbia, China, Malaysia, and Singapore. BizLink incorporates state-of-the-art facilities, advanced manufacturing processes, and professional research and development capabilities. Our global R&D and service teams in America, Europe, and Asia strive to keep collaborating closely with customers to turn their innovative ideas into reality. For more information, please refer to our website https://www.bizlinktech.com/.
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