BizLink Showcases Its Advanced Interconnect Solutions at OCP 2022
The Open Compute Project (OCP), the world’s most innovative organization, holds its annual global summit this year in October from 18 to 20. The global summit has become the largest gathering of technologies, with the theme of 2022 Empowering Open, it brings you the opportunity to celebrate and recognize the accomplishments of open collaboration with both software and hardware. This year BizLink is excited to showcase our Immersion Cooling and External Cable Solutions, PCIe6 OCP Interconnection, and ORV3 Rack and Power Solutions in Booth B14.
BizLink’s high-speed cable technology provides you the opportunity to explore the infinite of future data center development. Our latest 800G DAC and Loopback provide the high-speed 112Gbps/Lane transmission, and our power busbar connectors are compatible with 3M electronic liquids for immersion cooling applications. At the same time, we have our patent-designed high-density chassis and cassette being the highest density in the current market with a standard 1RU chassis having 432 ports of SN connector ports. As an industry leader, BizLink dedicates itself to developing the most advanced solutions to a more sustainable and reliable computing infrastructure where open collaboration makes everything happen.
With the explosive development of high-speed applications including Artificial intelligence (AI), 5G, machine learning, virtual reality, Augment reality, and cloud computing, BizLink has been developing innovative PCIe 6 interconnect solutions and is thrilled to share our latest products with you. Meanwhile, our ORV3 rack and power solutions provide you with universal AC power whips and connectors for grid and server connection, and power busbar connectors for Powershelf, BBU, and IT gear. As always, BizLink commits itself to keep pace with the technology development and provide solid support to our customers.