ODCC 2025

Intelligent Computing for the Future -Visit BizLink at 2025 ODCC!

BizLink, a global interconnect solutions provider, will showcase its innovative connectivity products designed for the next generation of artificial intelligence and high-performance computing (HPC) systems at the 2025 ODCC (Open Data Center Conference) held at the Beijing National Convention Center from September 9-11, 2025. We will present high-speed Direct Attach Cables (DAC) ranging from 10G to 1.6T, loopback modules, external high-speed cages, and various internal high-speed transmission and power connector products on site to assist customers in building high bandwidth, high reliability, and high scalability server and data center architectures.

1.6T DAC Support 200G per channel

Uses high-frequency raw cable and supports PAM4 signal transmission rates of up to 200Gbps per channel, ensuring excellent signal integrity and low loss even at extremely high bandwidths. With OSFP interface, it provides stable and efficient data connectivity between advanced network devices.

PCIe Gen5/6 high-speed internal connectivity solution

With the significant increase in internal I/O transmission requirements for server motherboards and AI acceleration cards, BizLink offers a range of PCIe Gen5/6 compatible internal high-speed connector and cable solutions:

• NearStack Connector: high-density, low insertion loss design, suitable for high-speed data transmission from board to board
  
• Multi Trak 16X+21A PWR Connector: integrates high-speed signal and high current power supply functions to meet the composite requirements of high-performance computing modules
  
• MCIO VT Connector (38pin/74pin): A vertical high-speed connector, paired with a high-frequency CEM Riser Cable, providing stable and efficient motherboard and interface card connection capabilities under space constraints

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Location: China National Convention Center, Beijing, China
Date: Sep 9-11,2025                    
Booth No.: C8 on 1st floor                    

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