BizLink proudly presents its cutting-edge interconnect solutions to multiply data rates, extend link lengths and enable efficient power management in high-performance computing at DesignCon 2024 - the must attend event for chip, board, and systems design engineers in Silicon Valley.
Meet our experts and discover BizLink’s high-speed and low-latency interconnects to reliably transmit AI & Machine Learning workloads, and to empower energy efficiency and data center scalability.
When?
January 31 to February 1, 2024
Where:
Booth No. 749 @ Santa Clara Convention Center, CA
In transmission path harmonization, seamless integration has got a name, and this is BizLink. We want to shape the future of high-performance computing, and we can’t wait to share this vision with you.
Our team on site will be on hand to showcase a wide range of products, including ORV3 power cable/connector/busbar, immersion cooling solutions, DC-MHS compliant PCIe Gen5/6 high speed internal cables/connectors, 1.6T OSFP DAC, 1.6T OSFP connector/cage, and ParaLink 60s for 224 G/lane - the NEXT copper generation crucial for 1.6T+ DAC, ACC & AEC transmission.
Still more to explore?
Definitely YES! BizLink transfers high-speed and energy efficiency to the automotive infrastructure, and has the most flexible low-friction elocab High-Performance Flex cables withstanding up to 150 million flex cycles to be applied in semicon production and other industries.
BizLink is set to pave the transmission ways for future communication. Are you?
We are looking forward to meeting you and to find out at DesignCon 2024, booth #749.
|
