Join us at SEMICON Japan 2023, booth 1112 (East 1 Hall), to witness our latest innovations in cable assemblies and robust built to print manufacturing capabilities for semiconductor equipment. Discover agile solutions for both high-mix low-volume and low-mix high-volume projects, ensuring precision and efficiency for your semiconductor applications.
What to Expect:
- Cutting-Edge Technology: Explore our advanced cable assembly solutions designed for modern semiconductor needs.
- Box Build System: Experience our Box Build & System Integration, crafted to meet the highest industry standards for reliability.
- Robust Manufacturing: Learn about our robust manufacturing capabilities, delivering consistent, high-quality products.
- Agile Solutions: Whether your projects are high-mix low-volume or low-mix high-volume, our solutions adapt to your requirements seamlessly.
Register now on the SEMICON Japan website to secure your spot. Don’t miss the chance to connect with industry experts, explore innovative products, and discover how our solutions can elevate your semiconductor applications.
We look forward to welcoming you at booth 1112 (East 1 Hall) for an exciting exploration of cutting-edge cable assembly solutions!