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- BizLink showcased extended range of data center connectivity solutions at DesignCon 2023
BizLink showcased extended range of data center connectivity solutions at DesignCon 2023
Fremont, 07 February 2023 - BizLink, a leading global interconnect solutions provider, presented its extended range of data center connectivity solutions at DesignCon 2023. Feature products displayed include its latest enhanced solutions for external and internal cabling, as well as power connectivity in data centers as highlights of the “GBIt/Z zone.”
At DesignCon 2023, BizLink showcased its advanced interconnect solutions which align with the latest trends in data centers, such as improved computing efficiency and stability, faster data transfer speed, and effective thermal management. With a focus on internal and external cables, power cables, and connectors, BizLink demonstrated how it creates value from innovation.
One of the highlights of the exhibition was BizLink's 100G/Lane active copper cables (ACCs). The QSFP112 ACC is a vital addition to BizLink's expanding portfolio for the growing 800G ecosystem. The live-demo successfully showed a 3m active QSFP112 assembly with an aggregated data transmission of 400G/s. Using MACOM’s redriver chip the power consumption was reduced to only 500 mW per end, which was a significant draw for attendees. The booth also featured a robust live-view PAM-4 eye that was displayed above the demo set-up. Multilane’s ML 4035 3-in-1 BERT, TDR, and DSO generated a PAM-4 PRBS pattern signal and also analyzed the results after passing through the QSFP112 assembly. With the engineering and sales team on-site, multiple technical deep-dive discussions were encouraged and everybody was impressed by the high margin transmission channels.
SFF-TA-1026 NearStack internal interconnect range showcase its capabilities in supporting up to PCIe Gen6 and maintaining a pad-to-pad loss budget of ~32dB at 16 GHz for a 64 GT/s PAM4 data rate, making it a highly efficient solution for cloud server providers. In addition, BizLink showcased its immersion cooling solutions, including power busbar connectors, 100G QSFP28 optical pigtails, and high power connector, BzLiza 150s, which are all compatible with 3M immersion cooling fluid. Rigorous material selection standards and thorough reliability tests demonstrated BizLink’s dedication to excellence.
BizLink continues to demonstrate its commitment to innovation and sustainability in the data center industry through its comprehensive interconnect solutions. Its commitment to efficiency, stability, and speed make BizLink a trusted partner and a leader in the industry. As the demand for efficient and sustainable interconnect solutions continues to grow, BizLink is well-positioned to meet those needs and drive continued success in the years to come.
BizLink, founded in 1996, is headquartered in Silicon Valley, USA. Our mission is to make interconnection easier and to become a leading global interconnect solution supplier. We support environmentally-conscious industries and improve quality of life through providing essential components, wire harnesses, and cables to a wide variety of industries such as IT Infrastructure, Client Peripherals, Optical Fiber Communications, Telecom and Networking, Electrical Appliances, Healthcare, Factory Automation, Machinery and Sensors, Motor Vehicle, Rolling Stock, Marine, Industrial, and Solar. With flexible production resources and global R&D teams in America, Europe, and Asia, BizLink always provides reliable interconnect solutions in close proximity to markets. BizLink also specializes in offering one-stop EMS and NPI services based on customer's requests. At BizLink, we strive to keep collaborating closely with customers to turn their innovative ideas into reality.