- Neuigkeiten & Ereignisse
- Enter “the GBIt/Z zone” at DesignCon 2023
Enter “the GBIt/Z zone” at DesignCon 2023
Fremont, 30 January 2023 - BizLink, a leading global interconnect solutions provider, is going to present its extended range of data center connectivity solutions at DesignCon, taking place from February 1 to February 2 this year at Santa Clara’s Convention Center. At booth 1249, visitors are invited to enter “the GBIt/Z zone” and explore the company’s enhanced solutions for external and internal cabling, as well as power connectivity in data centers.
DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronic innovation – Silicon Valley. In 2023, BizLink is thrilled to present its comprehensive data center connectivity solutions at DesignCon at booth 1249 with its product highlights of internal cables, external cables, and power cables and connectors.
Faster, thinner and more efficient solutions
BizLink commits itself to sustainability while providing high-quality and more efficient products for its customers. With its faster, thinner and more efficient DesignCon product highlights of external active 100G per lane copper solutions, internal SFF-TA-1026 compliant PCIe6 products, and immersion cooling ready power and rack solutions, the company is meeting recent data center trends in computing efficiency and stability, data transfer speed, and thermal management. BizLink’s latest 800G active and passive external copper interconnects provide reliable high-speed 112 Gbps/Lane transmission meanwhile significantly reducing the cable outer diameters with ParaLink low dielectric, low loss bulk cables. BizLink’s latest active 100G per lane solution over copper will be demonstrated live at booth 1249. With its SFF-TA-1026 NearStack internal interconnect product range to be exposed at DesignCon 2023, the company is able to support up to PCIe Gen6 with 1 m possible reach distance of passive cables maintaining pad-to-pad loss budget of ~32dB at 16 GHz for 64 GT/s PAM4 data rate. That makes them not only a faster, but more efficient solution for cloud server providers. Due to all the components submerged in non-conductive liquid with more efficient thermal management systems, BizLink has developed power busbar connectors, 100G QSFP28 optical immersion cooling pigtails and its high power connector BzLiza 150s compatible with 3M immersion cooling fluid. The company has set up high standards of material selection and reliability tests with its immersion cooling systems. This can be illustrated with samples on DesignCon display.
More to explore at the ‘Gbit/Z zone’
BizLink’s DesignCon product highlights are part of a comprehensive range of internal, external and power connectivity solutions for data centers, its DACs, ACCs, AOCs, loopbacks and internal high speed interconnects for various form factors and combinations. BizLink’s latest ParaLink twinaxial copper cable generations will be on display at booth 1249 with samples and expert talks, as well as its ORV3 external rack and power solutions of cables and connectors, which include AC power and DC busbar power solutions for Powershelf, BBU, and IT Gear.
Visitors are invited to find out more about BizLink’s extended global footprint and the professional integrated services from product design and development to customization and manufacturing, which turn the group’s products into interconnect solutions.
BizLink, founded in 1996, is headquartered in Silicon Valley, USA. Our mission is to make interconnection easier and to become a leading global interconnect solution supplier. We support environmentally-conscious industries and improve quality of life through providing essential components, wire harnesses, and cables to a wide variety of industries such as IT Infrastructure, Client Peripherals, Optical Fiber Communications, Telecom and Networking, Electrical Appliances, Healthcare, Factory Automation, Machinery and Sensors, Motor Vehicle, Rolling Stock, Marine, Industrial, and Solar. With flexible production resources and global R&D teams in America, Europe, and Asia, BizLink always provides reliable interconnect solutions in close proximity to markets. BizLink also specializes in offering one-stop EMS and NPI services based on customer's requests. At BizLink, we strive to keep collaborating closely with customers to turn their innovative ideas into reality.