OCP EMEA Summit 2026

BizLink to Showcase its Data Center Connectivity Solutions Tailored to European Standards at OCP EMEA Summit 2026

As a key partner in driving open computing standards, BizLink looks forward to engaging with the EMEA community and showcasing its leadership in high-performance interconnect solutions at the Open Compute Project (OCP) EMEA Summit 2026, 29-30 April at the Barcelona International Convention Center (CCIB) in Barcelona, Spain. The European edition of the OCP Global Summit brings together IT leaders and engineers to accelerate the development of open, scalable, and sustainable data center infrastructure tailored to the specific regulatory and efficiency needs of the European market. 
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Showcasing BizLink’s Broad Data Center Product Portfolio
BizLink’s exhibit will feature a comprehensive suite of solutions for the next generation of power-dense and high-speed AI data centers:

High-Density Power & Busbar Systems
Direct Liquid-Cooled Rack Busbars, Shelf Busbars, and specialized Internal Power Components designed to manage the ever-increasing power density of AI racks. 

High-Speed Copper Interconnects
A wide range of High-Performance Server Cables, DAC (Direct Attach Cables), and MPO connectors engineered for maximum reliability under heavy data loads in the MGX Ecosystem. 

High-Performance Optical Interconnects
1.6T and beyond optical interconnects and transceivers, CPO-ready optical architectures, and WDM modules that support highly scalable AI and HPC network deployments. 
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Advanced Solutions for European AI Infrastructure

By bridging its deep-rooted collaboration with Silicon Valley innovators to develop high-density power and cooling interconnects with its extensive experience navigating strict European regulations, BizLink serves as a premier partner for creating future-proof, high-performance data center infrastructure tailored to the EMEA market.
The connectivity expert’s broad product range and highly scalable production capabilities are tailored to deliver high-precision engineering solutions that meet stringent local requirements, including:

Material & Design
Custom cable designs, with silicone combining superior flexibility for tight routing with exceptional thermal resilience; Dr. Hendrik Coldenstrodt, CTO at BizLink’s Computing & Transportation Business Group invites for a 10 minute OCP EMEA talk on silicone power solutions and power whips on 30 April at the Summit.

Regional Compliance
Solutions addressing local specifications, such as CPR (Construction Products Regulation) compliance for cabling.

Power Delivery
High-density AC power whips and internal components, including options for specialized European plug configurations.

Thermal Management
Next-generation high-density liquid cooling cable design options and busbar solutions that maximize power usage effectiveness (PUE) and thermal performance in modern data centers.

“We invite visitors to connect with our experts to discuss how BizLink’s scalable production and high-precision engineering can support their most challenging AI infrastructure projects across the EMEA region.” says Eric Wu, Vice President of the High Performance Computing Business Unit at BizLink.
"We are looking forward to showing OCP EMEA visitors how BizLink is combining cable, connector, and detailed system knowledge in order to provide customers with the solutions needed for increasing power densities across the entire data center." adds Dr. Hendrik Coldenstrodt, CTO BizLink's Computing & Transportation Business Group.

At OCP EMEA Summit 2026, BizLink will prove its excellence in connecting possibilities for European IT leaders and engineers. 

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Date:          April 29–30, 2026
Venue:       Centre de Convencions Internacional de Barcelona (CCIB), Spain
Booth No.: B37
Email:        sales@bizlinktech.com

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