BizLink to Showcase Cutting-Edge High-Speed Connectivity and Power Solutions at OCP 2024
BizLink, a global leader in providing innovative interconnect solutions, is excited to announce its participation in the 2024 Open Compute Project (OCP) Global Summit. With extensive experience in the high-performance computing industry and a strong global footprint, BizLink is well-positioned to deliver advanced solutions that meet the evolving demands of next-generation AI, networking, and data communication systems.
At this year’s OCP event, BizLink will showcase its latest developments in high-speed interconnect and power solutions, designed to enhance performance and efficiency in compact AI server environments and next-gen data centers.
Key highlights include:
- PCIe Gen5/6 High-Speed Internal Interconnect Family: Featuring a variety of high-performance options such as MCIO, DA CEM Riser, NearStack, MultiTrak, and Gen-Z, this family of products offers innovative flattened wrapping cable routing for compact AI server spaces. These solutions help optimize space and improve efficiency in data-intensive environments.
- High-Speed External Cables for Next-Gen Networking: BizLink’s 1.6T OSFP DAC solutions, capable of carrying 224Gbps PAM4 signals per lane, enable ultra-high-speed connectivity for switches, servers, and storage systems. Complementing this is the 1.6T OSFP connector/cage and 224G high-speed bulk cable, designed for superior performance in future networking environments.
- AC 100A, DC 1000A Power Solutions and 1400A+ rack busbar for high power consumption in AI: Supporting 33kW to 70kW powershelves and over 200kW rack power, BizLink's robust power solutions ensure reliable and scalable power distribution, ideal for high-capacity data centers.
"BizLink is committed to driving innovation and delivering reliable, high-performance solutions that address the challenges of today’s rapidly evolving technology landscape," said Mike Lin, Sr. Vice President of Computing and Transportation Business Group at BizLink. "With our strong global presence and decades of experience, we are uniquely positioned to serve our customers in the high-performance computing industry with excellence and precision."
BizLink’s presence at OCP 2024 reinforces its dedication to providing professional, innovative solutions tailored to meet the evolving needs of the industry. The company’s participation highlights its ability to adapt to the increasing complexities of the digital age, showcasing its commitment to delivering high-quality solutions and support on a global scale.
About BizLink
Founded in 1996 and headquartered in Silicon Valley, USA, BizLink is dedicated to making transformative connections that bring visionary ideas to life. We specialize in providing essential components such as wire harnesses, connectors, and cables to a broad spectrum of industries including IT infrastructure, client peripherals, optical fiber communications, telecom and networking, electrical appliances, medical & healthcare, factory automation, machinery & sensors, motor vehicles, rolling stock, marine, industrial, and solar energy. Our global presence, with flexible production resources and R&D teams across America, Europe, and Asia, allows us to proactively drive innovation and enable future possibilities. At BizLink, our customer-centric approach and commitment to relentless advancement empower us to deliver zero-distance service and continual performance optimization, making a positive and meaningful impact worldwide. We turn possibilities into reality; furthermore, we connect possibilities to world-changing visions.