BizLink Technology, Inc. (TWSE: 3665) (“BizLink”), a global leader in interconnect solutions, is excited to announce its participation in this year’s SC24, the international conference for high-performance computing, networking, storage, and analysis. Visit Booth 438 from November 19-21 in Atlanta, Georgia, to discover BizLink’s PCIe Gen5/6 High-Speed Internal Interconnect family, designed to meet the increasing demands of high-density AI servers by maximizing computing power within constrained spaces.
At the booth, explore these groundbreaking innovations firsthand:
- Powerwhip with 60A design to support 33kW Powershelf
- Rack Busbar to support NVL36 70kW & NVL72 140kW Rack Power
- Power Cable for GB200 server power solutions
- Inner Busbar for GB200 server power busbar
- BizLink GB200 PCIe Gen5 MCIO Flattened Cable
- BizLink GB200 PCIe Gen5 CEM to MCIO Riser Cable
BizLink is proud to collaborate with some of the industry’s leading partners to bring advanced interconnect solutions to life. Among these is the PCIe Gen5 Flattened MCIO Cable Assembly, designed to efficiently route cables in the GB200 server while maintaining unobstructed airflow. As data rates advance to PCIe Gen5 and Gen6 levels, traditional PCB risers are no longer effective for extended routing distances. The Riser-to-MCIO Cable Assembly addresses this challenge by seamlessly carrying high-speed signals from the center to the back of the server, enabling PCIe extension without compromising performance or airflow efficiency.
BizLink looks forward to showcasing these cutting-edge solutions and connecting with global experts to explore the future of data center infrastructures. Visit us to discover the innovations that are driving the next generation of high-performance computing.