Empowering AI Connections, Unleashing Possibilities
BizLink is excited to announce its participation in DesignCon 2025, the premier event for chip, board, and systems design engineers. Join us at Booth #749 on January 29–30, 2025, at the Santa Clara Convention Center to discover BizLink’s groundbreaking innovations. Designed to empower AI connections and unlock extraordinary possibilities, our advanced solutions are redefining the future of high-performance computing and connectivity.
Among the highlights is the PCIe Gen5/6 High-Speed Internal Interconnect Family, featuring advanced options like MCIO and DA CEM Riser cables. These solutions leverage innovative flattened wrapping cable routing to maximize space and enhance efficiency in AI servers. BizLink’s collaboration with I-PEX on the CABLINE-CA IIP PLUS to MCIO Cable further elevates high-speed performance for next-generation applications.
For ultra-fast data transmission, BizLink’s 1.6T OSFP DAC solutions deliver connectivity at 224Gbps PAM4 per lane, paired with high-performance connectors, cages, and bulk cables for unparalleled networking capabilities. Robust power distribution solutions, including AC 100A and DC 1000A systems alongside 1400A+ rack busbars, ensure scalable and reliable power for high-capacity data centers.
BizLink is also setting new standards in durability and flexibility with its High-Performance Flex HPF Cable, engineered to withstand up to 150 million flex cycles—ideal for robotics and industrial applications. Additionally, cleanroom-grade IDC PTFE Ribbon Cables and custom solutions manufactured in Canada provide exceptional reliability for critical environments such as semiconductor and medical industries.
DesignCon 2025 is a hub for exploring the technologies shaping tomorrow’s world. BizLink’s unwavering commitment to innovation ensures exceptional performance, energy efficiency, and scalability across industries. Our experts will be at Booth #749, ready to connect, share insights, and showcase trailblazing solutions. Step into the future with BizLink, where AI drives innovation and unlocks endless possibilities.