We are thrilled to extend an invitation to you to visit BizLink at COMPUTEX 2025, from May 20–23 at Booth L0525, Nangang Exhibition Center, Hall 1, 4F, Taipei. This year, we will showcase our advanced interconnect solutions that are empowering businesses to scale up AI integration and foster innovation.
Featured Solutions:
Discover how our scalable, high-speed interconnects, power systems, co-packaged optics and copper are transforming AI data centers, enabling up to 1.6Tbps and optimized efficiency.
- AI Autonomous Driving and Smart Cockpit
See how our high-speed interconnects, smart cockpit systems, smart power electrification, and smart charging are advancing smart transportation, supporting both LV and NACS standards.
Engage with live demonstrations of our state-of-the-art AI robotic platforms and integrated hardware/software solutions. Interact with the AI robots and enjoy a special gift!
Explore compact, real-time processing AI modules that are enhancing smart workspaces and field applications with wireless and high-speed connectivity.
Why Choose BizLink, a World Leader in Interconnect Solutions?
BizLink is trusted by leading innovators across industries to drive next-gen AI transformation. With deep technical expertise and a global presence, we offer scalable, future-ready solutions tailored to your needs:
✔ Proven Expertise: Scaling up and out AI transformations in data centers, transportation, manufacturing, and more.
✔ Smart Transportation & Smart Manufacturing: High-speed, reliable interconnects to power autonomous driving, EVs, AI robotics, and industrial automation.
✔ Customized Engineering Capabilities: Custom solutions to fit your needs.
✔ Global Design and Production Networks: R&D and service teams across America, Europe, and Asia.
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