This year, we’re bringing solutions that address the challenges of AI, networking, and power management in data-intensive environments. At our booth, you’ll experience:
- PCIe Gen5/6 High-Speed Internal Interconnect Solutions, optimized for space efficiency in AI servers and designed for top-tier performance.
- Power Solutions for both AC 100A and DC 1000A applications, offering reliable, high-power support for powershelves of up to 66kW and rack power over 200kW.
- High-Speed External Cables including 1.6T OSFP DAC and 224Gbps PAM4 connectivity, driving the future of next-gen data communication and high-speed networking.
We invite you to stop by and connect with our team of experts to explore how these innovations can support your high-performance computing needs. It’s a great opportunity to see firsthand how BizLink is reshaping the future of the industry..
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